7月14日，联电宣布其位于新加坡的12英寸硅光子产线已开始批量生产先进光子芯片，满足AI数据中心对高速互连日益增长的需求。联电高级副总经理洪圭钧表示，硅光子和CPO技术将成为公司未来数年的重要增长动力。将光子芯片生产从传统8英寸晶圆转向12英寸，可有效降低光学损耗，提升功率效率与传输性能。新加坡本土光子芯片企业Silith Technology成为该产线首位核心战略客户，其客户包括光模块厂商中际旭创和Coherent，两家公司均为英伟达和谷歌的重要供应商。联电还与比利时微电子研究中心IMEC共同建设光子芯片生产平台，计划2027年起向更多客户开放。封装配套层面，联电规划2027年推出定制化先进封装业务，将光子芯片连接至中介层以缩短电气传输路径。长期规划上，联电计划2028年推出开放式硅光子开发平台，并同步开展薄膜铌酸锂芯粒技术研发。中国台湾、新加坡将共同作为联电光子芯片和先进封装业务的主要研发及制造基地，现阶段已组建百人专业技术团队。

On July 14, United Microelectronics Corporation (UMC) announced that its 12-inch silicon photonics production line in Singapore has begun volume production of advanced photonic chips, addressing growing demand for high-speed interconnects in AI data centers. UMC Senior Vice President Steven H. K. Hong said silicon photonics and CPO technologies will become important growth drivers for the company over the next several years. Shifting photonic chip production from traditional 8-inch wafers to 12-inch wafers can effectively reduce optical loss while improving power efficiency and transmission performance. Singapore-based photonic chip company Silith Technology has become the first core strategic customer of the production line. Its customers include optical module maker Zhongji Innolight and Coherent, both of which are major suppliers to Nvidia and Google. UMC is also jointly building a photonic chip production platform with Belgium-based microelectronics research center imec, with plans to open the platform to more customers starting in 2027. On the packaging side, UMC plans to launch customized advanced packaging services in 2027, connecting photonic chips to interposers to shorten electrical transmission paths. In its long-term roadmap, UMC plans to launch an open silicon photonics development platform in 2028 while also carrying out R&D on thin-film lithium niobate chiplet technology. China’s Taiwan region and Singapore will jointly serve as UMC’s main R&D and manufacturing bases for photonic chips and advanced packaging. The company has already assembled a specialized technical team of around 100 people.

7月8日，安森美宣布已就出售两座分别位于菲律宾和美国宾夕法尼亚州的芯片制造工厂与交易对方达成最终协议。此举是其“Fab Right”战略的一部分，旨在改善整体制造成本结构、推动毛利率持续增长。两笔交易预计每年可为安森美节省约3500万美元成本，初步节省将于2027年开始，全部节省于2028年实现。其中，安森美将把位于菲律宾Tarlac的工厂出售给力成集团旗下的台湾地区OSAT业者超丰电子，交易预计未来三到六个月内完成。双方已达成长期供货协议，确保交易完成后能够继续履行对客户的承诺。此外，瑞典Silex Microsystems将接手安森美位于美国宾夕法尼亚州Mountain Top的工厂，交易预计于2028年1月完成，延长过渡期旨在让安森美有序转移该工厂目前生产的产品至其网络内的其他工厂，确保客户业务连续性。

On July 8, onsemi announced that it has entered into definitive agreements with counterparties to sell two chip manufacturing facilities located in the Philippines and Pennsylvania, United States. The move is part of the company’s “Fab Right” strategy, aimed at improving its overall manufacturing cost structure and driving continued gross margin expansion. The two transactions are expected to generate approximately USD 35mn in annual cost savings for onsemi. Initial savings are expected to begin in 2027, with the full savings to be realized in 2028. Under the agreements, onsemi will sell its facility in Tarlac, Philippines to Greatek Electronics, a Taiwan-based OSAT provider under Powertech Technology Group. The transaction is expected to close within the next three to six months. The two parties have also entered into a long-term supply agreement to ensure that onsemi can continue meeting customer commitments after the transaction closes. In addition, Sweden-based Silex Microsystems will take over onsemi’s facility in Mountain Top, Pennsylvania. The transaction is expected to close in January 2028. The extended transition period is designed to allow onsemi to transfer products currently manufactured at the facility to other fabs within its network in an orderly manner, ensuring business continuity for customers.

韩国政府拟投资约800万亿韩元建设西南部四座芯片厂，三星SK海力士各建两座 6月29日，韩国产业通商资源部长官金正官表示，预计将在韩国西南部建设四座芯片厂，投资约800万亿韩元（约合人民币4.2万亿元）。其中三星电子和SK海力士分别规划建设两座。同时，韩国政府表示，预计未来15年在芯片领域的投资将至少达到30万亿韩元，涵盖下一代内存、边缘人工智能和国防等领域。根据规划，中部地区将重点发展先进封装，东南部将打造半导体材料、零部件、设备及新一代功率半导体产业集群。忠清地区的芯片封装集群投资预计达到81万亿韩元。

South Korea Plans Approximately KRW 800tn Investment to Build Four Chip Fabs in Southwest Region, with Samsung and SK Hynix Each to Build Two On June 29, South Korea’s Minister of Trade, Industry and Energy Kim Jung-kwan said that four chip fabs are expected to be built in the country’s southwest region, with total investment of approximately KRW 800tn, equivalent to around RMB 4.2tn. Samsung Electronics and SK Hynix each plan to build two fabs. At the same time, the South Korean government said investment in the semiconductor sector over the next 15 years is expected to reach at least KRW 30tn, covering areas including next-generation memory, edge AI, and defense applications. Under the plan, the central region will focus on advanced packaging, while the southeast region will develop semiconductor materials, components, equipment, and next-generation power semiconductor clusters. Investment in the chip packaging cluster in the Chungcheong region is expected to reach KRW 81tn.