7月8日，安森美宣布已就出售两座分别位于菲律宾和美国宾夕法尼亚州的芯片制造工厂与交易对方达成最终协议。此举是其“Fab Right”战略的一部分，旨在改善整体制造成本结构、推动毛利率持续增长。两笔交易预计每年可为安森美节省约3500万美元成本，初步节省将于2027年开始，全部节省于2028年实现。其中，安森美将把位于菲律宾Tarlac的工厂出售给力成集团旗下的台湾地区OSAT业者超丰电子，交易预计未来三到六个月内完成。双方已达成长期供货协议，确保交易完成后能够继续履行对客户的承诺。此外，瑞典Silex Microsystems将接手安森美位于美国宾夕法尼亚州Mountain Top的工厂，交易预计于2028年1月完成，延长过渡期旨在让安森美有序转移该工厂目前生产的产品至其网络内的其他工厂，确保客户业务连续性。

On July 8, onsemi announced that it has entered into definitive agreements with counterparties to sell two chip manufacturing facilities located in the Philippines and Pennsylvania, United States. The move is part of the company’s “Fab Right” strategy, aimed at improving its overall manufacturing cost structure and driving continued gross margin expansion. The two transactions are expected to generate approximately USD 35mn in annual cost savings for onsemi. Initial savings are expected to begin in 2027, with the full savings to be realized in 2028. Under the agreements, onsemi will sell its facility in Tarlac, Philippines to Greatek Electronics, a Taiwan-based OSAT provider under Powertech Technology Group. The transaction is expected to close within the next three to six months. The two parties have also entered into a long-term supply agreement to ensure that onsemi can continue meeting customer commitments after the transaction closes. In addition, Sweden-based Silex Microsystems will take over onsemi’s facility in Mountain Top, Pennsylvania. The transaction is expected to close in January 2028. The extended transition period is designed to allow onsemi to transfer products currently manufactured at the facility to other fabs within its network in an orderly manner, ensuring business continuity for customers.

韩国政府拟投资约800万亿韩元建设西南部四座芯片厂，三星SK海力士各建两座 6月29日，韩国产业通商资源部长官金正官表示，预计将在韩国西南部建设四座芯片厂，投资约800万亿韩元（约合人民币4.2万亿元）。其中三星电子和SK海力士分别规划建设两座。同时，韩国政府表示，预计未来15年在芯片领域的投资将至少达到30万亿韩元，涵盖下一代内存、边缘人工智能和国防等领域。根据规划，中部地区将重点发展先进封装，东南部将打造半导体材料、零部件、设备及新一代功率半导体产业集群。忠清地区的芯片封装集群投资预计达到81万亿韩元。

South Korea Plans Approximately KRW 800tn Investment to Build Four Chip Fabs in Southwest Region, with Samsung and SK Hynix Each to Build Two On June 29, South Korea’s Minister of Trade, Industry and Energy Kim Jung-kwan said that four chip fabs are expected to be built in the country’s southwest region, with total investment of approximately KRW 800tn, equivalent to around RMB 4.2tn. Samsung Electronics and SK Hynix each plan to build two fabs. At the same time, the South Korean government said investment in the semiconductor sector over the next 15 years is expected to reach at least KRW 30tn, covering areas including next-generation memory, edge AI, and defense applications. Under the plan, the central region will focus on advanced packaging, while the southeast region will develop semiconductor materials, components, equipment, and next-generation power semiconductor clusters. Investment in the chip packaging cluster in the Chungcheong region is expected to reach KRW 81tn.

企业动态(6月23日) 拆分芯片团队独立造芯，快手垂直算力自研实现商业化突破 近日，快手拆分内部芯片事业部成立凌川科技完成数亿元A+轮融资，标志其自研造芯业务全面走向独立市场化运营。凌川科技2024年3月正式独立，由快手联合北京AI基金控股，专注视频与多模态大模型专用算力芯片研发。旗下成熟产品SL200累计出货近十万颗，覆盖快手99.7%直播转码业务，支撑平台7亿用户视频流转，同时对外供货阿里云、百度云、B站等企业。该芯片连续三年拿下国际视频编码赛事冠军，压缩效率优于英伟达同类方案，算力能耗降低三成。新一代全国产3D堆叠芯片已于4月完成流片，本轮融资将用于新品迭代、现有芯片扩产及海外市场拓展。依托互联网场景优势，凌川同步推出加速卡、算力一体机等硬件方案，落地智算、安防、车载多场景，成为国内垂直视频算力赛道核心国产供应商。 点评：快手独立造芯是互联网平台算力自主化的典型缩影，与阿里平头哥、百度昆仑芯路径趋同，印证大厂自研专用芯片已成行业必然选择。过去短视频、直播平台高度依赖海外通用GPU，采购与运维成本居高不下，同时存在算力供给约束风险，自研ASIC芯片可深度贴合视频转码、AI推理专属需求，实现降本与自主可控双重目标。不同于通用大算力芯片赛道的激烈内卷，凌川深耕视频垂直领域，以真实业务场景反向定义芯片架构，形成差异化竞争壁垒。从内部自用走向对外商用，也打开互联网芯片企业盈利空间，推动国产算力软硬件生态协同完善。快手独立造芯将带动上下游流片、封装、服务器产业链需求释放，加速国内多模态算力底层装备国产化进程。

Company Trend（June 23） Kuaishou Chip Unit Lingchuan Technology Achieves Commercial Breakthrough in In-House AI Compute Chips Kuaishou has spun off its internal chip division into an independent entity, Lingchuan Technology, which has completed a Series A+ funding round raising several hundred million RMB, marking a full transition of its self-developed chip business toward independent market-oriented operations. Lingchuan Technology was formally established as an independent company in March 2024, jointly controlled by Kuaishou and a Beijing AI fund, focusing on the development of dedicated compute chips for video processing and multimodal large models. Its flagship mature product SL200 has shipped nearly 100,000 units, covering 99.7% of Kuaishou’s live-streaming transcoding workloads and supporting video traffic for approximately 700 million platform users. The chip is also supplied to external customers including Alibaba Cloud, Baidu Cloud, and Bilibili. The SL200 has reportedly won international video encoding competitions for three consecutive years, delivering higher compression efficiency than comparable Nvidia solutions while reducing compute energy consumption by approximately 30%. A next-generation fully domestic 3D-stacked chip completed tape-out in April 2026. The new funding will be used for product iteration, capacity expansion of existing chips, and overseas market development. Leveraging its internet-scale application scenarios, Lingchuan Technology is also deploying hardware solutions including AI acceleration cards and integrated compute appliances, targeting use cases in intelligent computing, security, and automotive applications. The company is emerging as a key domestic supplier in China’s vertical video compute chip segment.